Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2021-06-29 |
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +2 more | 2021-05-18 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10978382 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-13 |
| 10861841 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Ban-Li Wu +2 more | 2020-12-08 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai +5 more | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2020-11-10 |
| 10790269 | Semiconductor devices and semiconductor structures | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2020-09-29 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2020-05-19 |