Issued Patents All Time
Showing 26–50 of 229 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu +1 more | 2024-07-16 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Po-Yuan Teng, Chi-Hui Lai | 2024-06-11 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2024-05-21 |
| 11961810 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Chen-Shien Chen | 2024-04-16 |
| 11923318 | Method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Hao-Yi Tsai | 2024-03-05 |
| 11923349 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2024-03-05 |
| 11908706 | Cross-wafer RDLs in constructed wafers | Chen-Hua Yu | 2024-02-20 |
| 11855016 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2023-12-26 |
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Shih-Wei Chen, Hao-Yi Tsai | 2023-12-26 |
| 11848319 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2023-12-19 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2023-12-19 |
| 11848235 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Che-Wei Hsu | 2023-12-19 |
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tzung-Hui Lee +1 more | 2023-12-19 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11830866 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2023-11-28 |
| 11824017 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Shih-Wei Chen | 2023-11-21 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11798925 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2023-10-24 |
| 11776905 | Package structure, package-on-package structure and manufacturing method thereof | Chuei-Tang Wang | 2023-10-03 |
| 11776880 | Surface treatment method and apparatus for semiconductor packaging | Chih-Horng Chang, Jie Deng, Ying-Yu Chen | 2023-10-03 |
| 11764171 | Integrated circuit structure and method | Chen-Hua Yu, Kuo Lung Pan, Hao-Yi Tsai | 2023-09-19 |
| 11749640 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2023-09-05 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |