Issued Patents All Time
Showing 76–100 of 229 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404316 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Che-Wei Hsu | 2022-08-02 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Yi-Yang Lei +2 more | 2022-06-07 |
| 11342295 | Electronic assembly, package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2022-05-24 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-05-03 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu, Yao-Chun Chuang | 2022-04-26 |
| 11315805 | Cross-wafer RDLs in constructed wafers | Chen-Hua Yu | 2022-04-26 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2022-04-19 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2022-04-19 |
| 11296062 | Three-dimension large system integration | Chen-Hua Yu | 2022-04-05 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tzung-Hui Lee +1 more | 2022-03-29 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Yu-Chia Lai, Shih-Wei Chen | 2022-03-22 |
| 11239135 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Po-Yuan Teng, Chi-Hui Lai | 2022-02-01 |
| 11211346 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2021-12-28 |
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2021-12-21 |
| 11201118 | Chip package and method of forming the same | Kuo Lung Pan, Hao-Yi Tsai | 2021-12-14 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +2 more | 2021-11-23 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Shih-Wei Chen | 2021-11-16 |
| 11164819 | Semiconductor package and manufacturing method thereof | Ying-Cheng Tseng, Hao-Yi Tsai, Chia-Hung Liu, Chi-Hui Lai | 2021-11-02 |
| 11158576 | Package structure having redistribution layer structures | Chih-Hao Chang, Hao-Yi Tsai, Tsung-Hsien Chiang | 2021-10-26 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-09-14 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11107772 | Semiconductor package and method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Hao-Yi Tsai | 2021-08-31 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu +1 more | 2021-08-17 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |