Issued Patents All Time
Showing 51–75 of 229 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Shih-Wei Chen | 2023-07-04 |
| 11694966 | Chip package and method of forming the same | Kuo Lung Pan, Hao-Yi Tsai | 2023-07-04 |
| 11682655 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Hao-Yi Tsai | 2023-06-20 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Shih-Wei Chen, Hao-Yi Tsai | 2023-06-20 |
| 11658143 | Bump-on-trace design for enlarge bump-to-trace distance | Sheng-Yu Wu, Chen-Shien Chen | 2023-05-23 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu +3 more | 2023-05-09 |
| 11631648 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Chen-Shien Chen, Yen-Liang Lin | 2023-04-18 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2023-01-31 |
| 11538788 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2022-12-27 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai +2 more | 2022-12-27 |
| 11532594 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2022-12-20 |
| 11532529 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2022-12-20 |
| 11515268 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Shih-Wei Chen | 2022-11-29 |
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2022-11-22 |
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2022-11-22 |
| 11508665 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai, Chen-Hua Yu | 2022-11-22 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang +1 more | 2022-11-15 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2022-11-15 |
| 11495590 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-08 |
| 11488897 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-01 |
| 11456249 | Package structure, package-on-package structure and manufacturing method thereof | Chuei-Tang Wang | 2022-09-27 |
| 11444002 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2022-09-13 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-08-23 |
| 11417638 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2022-08-16 |
| 11417633 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Hao-Yi Tsai, Chung-Shi Liu | 2022-08-16 |