Issued Patents All Time
Showing 26–50 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11309225 | Fan-out package structure and method of manufacturing the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2021-12-21 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2021-12-07 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2021-11-09 |
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Ting-Ting Kuo, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Chih-Hsuan Tai +1 more | 2021-10-26 |
| 11018086 | Passive devices in package-on-package structures and methods for forming the same | Chen-Shien Chen | 2021-05-25 |
| 11010580 | Fingerprint sensor in InFO structure and formation method | Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2021-05-18 |
| 10964610 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2021-03-30 |
| 10937718 | Package structures and method of forming the same | Chen-Hua Yu, Hao-Yi Tsai, Yu-Feng Chen | 2021-03-02 |
| 10879228 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2020-12-29 |
| 10878073 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2020-12-29 |
| 10879221 | Package-on-package structure | Chun-Ti Lu, Hao-Yi Tsai, Ming Hung Tseng, Yen-Liang Lin | 2020-12-29 |
| 10853616 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-01 |
| 10811384 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-10-20 |
| 10762319 | Fingerprint sensor and manufacturing method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2020-09-01 |
| 10720416 | Semiconductor package including thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-07-21 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2020-06-30 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2020-06-02 |
| 10658334 | Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die | Yu-Jen Cheng, Yu-Chih Huang, Yu-Feng Chen, Hao-Yi Tsai | 2020-05-19 |
| 10629580 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2020-04-21 |
| 10610720 | Mouth-opening training device having water-filled bag | Mu-Kuan Chen, Gene Chen, Mei-Hui Chang | 2020-04-07 |