Issued Patents All Time
Showing 76–100 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748216 | Apparatus and method for a component package | Chen-Shien Chen, Ching-Wen Hsiao, Ming Hung Tseng | 2017-08-29 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Wei Lin, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9679836 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chen-Cheng Kuo | 2017-06-13 |
| 9646894 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2017-05-09 |
| 9589941 | Multi-chip package system and methods of forming the same | Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2017-03-07 |
| 9490167 | Pop structures and methods of forming the same | Hsu-Hsien Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2016-11-08 |
| 9478474 | Methods and apparatus for forming package-on-packages | Hsu-Hsien Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2016-10-25 |
| 9343442 | Passive devices in package-on-package structures and methods for forming the same | Chen-Shien Chen | 2016-05-17 |
| 9312230 | Conductive pillar structure for semiconductor substrate and method of manufacture | Chen-Shien Chen, Chen-Cheng Kuo | 2016-04-12 |
| 9293449 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Shou-Cheng Hu, Chen-Shien Chen, Tin-Hao Kuo, Ching-Wen Hsiao | 2016-03-22 |
| 9257332 | Through-assembly via modules and methods for forming the same | Chen-Shien Chen, Ching-Wen Hsiao | 2016-02-09 |
| 9258922 | PoP structures including through-assembly via modules | Chen-Shien Chen, Ching-Wen Hsiao | 2016-02-09 |
| 9224688 | Metal routing architecture for integrated circuits | Chita Chuang, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2015-12-29 |
| 9173019 | Loudspeaker with rotatable sound-reflecting member | — | 2015-10-27 |
| 9070644 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2015-06-30 |
| 9040350 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo | 2015-05-26 |
| 9031263 | Loudspeaker | — | 2015-05-12 |
| 8975726 | POP structures and methods of forming the same | Hsu-Hsien Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2015-03-10 |
| 8967963 | Fan module | — | 2015-03-03 |
| 8928114 | Through-assembly via modules and methods for forming the same | Chen-Shien Chen, Ching-Wen Hsiao | 2015-01-06 |
| 8922005 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Yen-Chang Hu, Ching-Wen Hsiao, Chen-Shien Chen, Tin-Hao Kuo | 2014-12-30 |
| 8916971 | Multi-direction design for bump pad structures | Chen-Shien Chen, Chen-Cheng Kuo, Tzuan-Horng Liu | 2014-12-23 |
| 8889484 | Apparatus and method for a component package | Chen-Shien Chen, Ching-Wen Hsiao, Ming Hung Tseng | 2014-11-18 |
| 8765497 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo | 2014-07-01 |
| 8753971 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei +3 more | 2014-06-17 |