Issued Patents All Time
Showing 101–125 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8737063 | Fastening device for hard disk drive | — | 2014-05-27 |
| 8729700 | Multi-direction design for bump pad structures | Chen-Shien Chen, Chen-Cheng Kuo, Tzuan-Horng Liu | 2014-05-20 |
| 8703609 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Chen Chen-Shien, Kai-Ming Ching | 2014-04-22 |
| 8653648 | Zigzag pattern for TSV copper adhesion | Chen-Shien Chen, Chen-Cheng Kuo, Wen-Wei Shen | 2014-02-18 |
| 8624376 | Package-on-package structure without through assembly vias | Chen-Shien Chen | 2014-01-07 |
| 8613588 | Fan module and vibration-damping mounting therefor | — | 2013-12-24 |
| 8598715 | Bump-on-trace structures in packaging | — | 2013-12-03 |
| 8546941 | Multi-direction design for bump pad structures | Chen-Shien Chen, Chen-Cheng Kuo, Tzuan-Horng Liu | 2013-10-01 |
| 8476769 | Through-silicon vias and methods for forming the same | Chen-Shien Chen, Chen-Cheng Kuo, Kuo-Ching Hsu, Kai-Ming Ching | 2013-07-02 |
| 8431421 | Test patterns for detecting misalignment of through-wafer vias | — | 2013-04-30 |
| 8322974 | Fan module with vibration-resistent mounting | — | 2012-12-04 |
| 8315054 | Rack server center | — | 2012-11-20 |
| 8259965 | Loudspeaker device with sound enhancing structure | — | 2012-09-04 |
| 8202800 | Method of forming through silicon via with dummy structure | Chen-Shien Chen, Chen-Cheng Kuo, Wen-Wei Shen | 2012-06-19 |
| 8193639 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei +3 more | 2012-06-05 |
| 8178970 | Strong interconnection post geometry | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ching-Wen Hsiao | 2012-05-15 |
| 8049327 | Through-silicon via with scalloped sidewalls | Chen-Cheng Kuo, Ming-Fa Chen, Chen-Shien Chen | 2011-11-01 |
| 7973413 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Chen Chen-Shien, Kai-Ming Ching | 2011-07-05 |
| 7969013 | Through silicon via with dummy structure and method for forming the same | Chen-Shien Chen, Chen-Cheng Kuo, Wen-Wei Shen | 2011-06-28 |
| 7816227 | Tapered through-silicon via structure | Chen-Shien Chen, Chen-Cheng Kuo, Kai-Ming Ching | 2010-10-19 |
| 7785927 | Multi-die wafer level packaging | Chen-Shien Chen, Kai-Ming Ching, Chen-Cheng Kuo | 2010-08-31 |
| 7564115 | Tapered through-silicon via structure | Chen-Shien Chen, Chen-Cheng Kuo, Kai-Ming Ching | 2009-07-21 |
| 7557423 | Semiconductor structure with a discontinuous material density for reducing eddy currents | Kai-Ming Ching, Chen Chen-Shien, Han-Hsiang Huang, Chen-Cheng Kuo | 2009-07-07 |
| 7528492 | Test patterns for detecting misalignment of through-wafer vias | — | 2009-05-05 |
| 7514797 | Multi-die wafer level packaging | Chen-Shien Chen, Kai-Ming Ching, Chen-Cheng Kuo | 2009-04-07 |