Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381163 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2025-08-05 |
| 12374627 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2025-07-29 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2024-07-16 |
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2024-06-04 |
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Shih-Wei Chen, Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chia-Hung Liu +1 more | 2023-11-28 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2023-05-30 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2022-02-08 |
| 11133269 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2021-09-28 |
| 10879221 | Package-on-package structure | Chih-Hua Chen, Hao-Yi Tsai, Ming Hung Tseng, Yen-Liang Lin | 2020-12-29 |
| 10867809 | Laser anneal process | Meng-Chin Lee, Fang-Liang Lu, Chee-Wee Liu | 2020-12-15 |