Issued Patents All Time
Showing 1–25 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381163 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2025-08-05 |
| 12362274 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2025-07-15 |
| 12334434 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2025-06-17 |
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2024-06-04 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2024-03-12 |
| 11855232 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu +2 more | 2023-12-26 |
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Shih-Wei Chen, Yu-Chih Huang, Chih-Hao Chang, Chun-Ti Lu, Chia-Hung Liu +1 more | 2023-11-28 |
| 11640776 | Arcuate display device and driving method thereof | Yu-Chu Chen, Chun-Hui Huang, Yu-Chi Kang, Yi-Hsiang Hu, Wei-Ting Chen | 2023-05-02 |
| 11374136 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu +2 more | 2022-06-28 |
| 11159457 | Chatbot orchestration | Lin Chung Liang, Chao Yuan Huang, Jen Ping Cheng, Yen Lin Li | 2021-10-26 |
| 11151597 | Interruption point determination | Jen Ping Cheng, Chao Yuan Huang, Yen Lin Li, Lin Chung Liang | 2021-10-19 |
| 11004786 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2021-05-11 |
| 10923455 | Semiconductor apparatus and method for preparing the same | Chin-Lung Chu | 2021-02-16 |
| 10825794 | Method for preparing a semiconductor apparatus | Chin-Lung Chu | 2020-11-03 |
| 10811545 | Sensing module and image capturing apparatus | Chiung-Han Wang, Wen-Chen Lee, Jen-Chieh Wu | 2020-10-20 |
| 10607858 | Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface | Chin-Lung Chu | 2020-03-31 |
| 10580665 | Method for manufacturing package structure having elastic bump | — | 2020-03-03 |
| 10566294 | Semiconductor structure | Chin-Lung Chu | 2020-02-18 |
| 10552862 | Interruption point determination | Jacqueline Cheng, Chao Yuan Huang, Yen Lin Li, Lin Chung Liang | 2020-02-04 |
| 10535621 | Method for preparing a semiconductor package | — | 2020-01-14 |
| 10446514 | Combing bump structure and manufacturing method thereof | Chin-Lung Chu | 2019-10-15 |
| 10438887 | Semiconductor chip and multi-chip package using thereof and method for manufacturing the same | — | 2019-10-08 |
| 10431559 | Method for manufacturing a semiconductor structure | — | 2019-10-01 |
| 10373932 | Stacked semiconductor structure | Chin-Lung Chu | 2019-08-06 |
| 10361171 | Stacked package structure and manufacturing method thereof | — | 2019-07-23 |