Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923455 | Semiconductor apparatus and method for preparing the same | Po-Chun Lin | 2021-02-16 |
| 10825794 | Method for preparing a semiconductor apparatus | Po-Chun Lin | 2020-11-03 |
| 10607858 | Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface | Po-Chun Lin | 2020-03-31 |
| 10566294 | Semiconductor structure | Po-Chun Lin | 2020-02-18 |
| 10446514 | Combing bump structure and manufacturing method thereof | Po-Chun Lin | 2019-10-15 |
| 10373932 | Stacked semiconductor structure | Po-Chun Lin | 2019-08-06 |
| 10290512 | Semiconductor structure having bump on tilting upper corner surface | Po-Chun Lin | 2019-05-14 |
| 10192853 | Method for preparing a semiconductor apparatus | Po-Chun Lin | 2019-01-29 |
| 10170432 | Semiconductor structure | Po-Chun Lin | 2019-01-01 |
| 10068865 | Combing bump structure and manufacturing method thereof | Po-Chun Lin | 2018-09-04 |
| 10050021 | Die device, semiconductor device and method for making the same | Po-Chun Lin | 2018-08-14 |
| 9966363 | Semiconductor apparatus and method for preparing the same | Po-Chun Lin | 2018-05-08 |
| 9935071 | Semiconductor package with lateral bump structure | Po-Chun Lin | 2018-04-03 |
| 9905549 | Semiconductor apparatus and method for preparing the same | Po-Chun Lin | 2018-02-27 |
| 9893037 | Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof | Po-Chun Lin | 2018-02-13 |