Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9893035 | Stacked package structure and manufacturing method thereof | — | 2018-02-13 |
| 9893037 | Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof | Chin-Lung Chu | 2018-02-13 |
| 9881867 | Conductive connection structure having stress buffer layer | — | 2018-01-30 |
| 9831155 | Chip package having tilted through silicon via | — | 2017-11-28 |
| 9812414 | Chip package and a manufacturing method thereof | — | 2017-11-07 |
| 9799624 | Wire bonding method and wire bonding structure | — | 2017-10-24 |
| 9786593 | Semiconductor device and method for forming the same | — | 2017-10-10 |
| 9761535 | Interposer, semiconductor package with the same and method for preparing a semiconductor package with the same | — | 2017-09-12 |
| 9711442 | Semiconductor structure | — | 2017-07-18 |
| 9704818 | Semiconductor structure and manufacturing method thereof | — | 2017-07-11 |
| 9664852 | Optical waveguide having several dielectric layers and at least one metal cladding layer | — | 2017-05-30 |
| 9536785 | Method of manufacturing through silicon via stacked structure | — | 2017-01-03 |
| 9508673 | Wire bonding method | — | 2016-11-29 |
| 9362254 | Wire bonding method and chip structure | — | 2016-06-07 |
| 9305902 | Chip package and method for forming the same | — | 2016-04-05 |
| 9281242 | Through silicon via stacked structure and a method of manufacturing the same | — | 2016-03-08 |
| 9252105 | Chip package | — | 2016-02-02 |
| 9240381 | Chip package and method for forming the same | — | 2016-01-19 |
| 9147642 | Integrated circuit device | — | 2015-09-29 |