Issued Patents All Time
Showing 51–75 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2020-06-30 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2020-05-19 |
| 10658334 | Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die | Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai | 2020-05-19 |
| 10630455 | Method and transmitter for non-orthogonal multiple access communication system | Shin-Lin Shieh | 2020-04-21 |
| 10510631 | Fan out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo | 2019-12-17 |
| 10354114 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai | 2019-07-16 |
| 10268872 | Fingerprint sensor device and method | Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2019-04-23 |
| 10157808 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2018-12-18 |
| 10157874 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu | 2018-12-18 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-12-18 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-27 |
| 9898645 | Fingerprint sensor device and method | Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-20 |
| 9871013 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu | 2018-01-16 |
| 9799620 | Warpage reduction and adhesion improvement of semiconductor die package | Yen-Chang Hu, Ching-Wen Hsiao, Chen-Shien Chen | 2017-10-24 |
| 9691708 | Semiconductor package and manufacturing method thereof | Chih-Hua Chen, Chih-Wei Lin, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Chun-Cheng Lin, Kuei-Wei Huang, Yu-Feng Chen, Chen-Shien Chen | 2017-03-07 |
| 9400118 | Hot water supply system and method thereof | Jung-Tzung Wei | 2016-07-26 |
| 9379032 | Semiconductor packaging having warpage control and methods of forming same | Chun-Cheng Lin, Kuei-Wei Huang, Yu-Feng Chen, Chen-Shien Chen | 2016-06-28 |
| 9087832 | Warpage reduction and adhesion improvement of semiconductor die package | Yen-Chang Hu, Ching-Wen Hsiao, Chen-Shien Chen | 2015-07-21 |
| 9070667 | Peripheral electrical connection of package on package | Ching-Wen Hsiao, Chih-Wei Lin, Wei Sen Chang, Yen-Chang Hu, Kuo Lung Pan | 2015-06-30 |
| 9048935 | Joint synchronization and modulation scheme for energy-efficient communication | Urs Niesen, Piyush Gupta | 2015-06-02 |
| 8614444 | Top-gate transistor array substrate | Huang-Chung Cheng, Po-Yu Yang, Shin-Chuan Chiang, Huai-An Li | 2013-12-24 |
| 6716651 | Method and apparatus for identifying a wafer cassette | Martin Weng, Jung-Huang Peng, Robin Lien | 2004-04-06 |