Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11871810 | Communication helmet | — | 2024-01-16 |
| 8604613 | Electronic assembly having a multilayer adhesive structure | Su-Tsai Lu | 2013-12-10 |
| 8247908 | Circuit substrate and method for utilizing packaging of the circuit substrate | Yao-Sheng Lin | 2012-08-21 |
| 8023060 | Flexible display | Yao-Sheng Lin, Su-Yu Fun | 2011-09-20 |
| 7378746 | Composite bump | Ji-Cheng Lin, Yao-Sheng Lin, Shyh-Ming Chang, Su-Tsai Lu, Hsien-Chie Cheng | 2008-05-27 |
| 6767818 | Method for forming electrically conductive bumps and devices formed | Shyh-Ming Chang, Yu-Te HSIEH, Chun-Ming Huang, Jui-Ming Ni, Ching-Yun Chang +1 more | 2004-07-27 |
| 6501525 | Method for interconnecting a flat panel display having a non-transparent substrate and devices formed | Yuan-Chang Huang | 2002-12-31 |
| 5906725 | Method for preparing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from zinc-containing waste articles having a nickel/copper electroplating layer | Jing-Chie Lin, Jyh-Yeong Lin, Fong-Ru Yang, Jyh-Herng Chen | 1999-05-25 |
| 5888373 | Method for repairing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from acidic waste solutions containing nickel and zinc ions and electroplating thereof | Jin-Chie Lin, Chih-Chia Chen, Fong-Ru Yang, Jyh-Herng Chen | 1999-03-30 |