Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8558357 | Ultra thin image sensor package structure and method for fabrication | Chih-Wen Lin | 2013-10-15 |
| 8243007 | Image display device and method | Wei Zhang, Huajun Peng, Chun Kit Hung | 2012-08-14 |
| 8228272 | Backlight device and liquid crystal display incorporating the backlight device | Huajun Peng, Ya-Hsien Chang | 2012-07-24 |
| 8207931 | Method of displaying a low dynamic range image in a high dynamic range | Wei Zhang, Huajun Peng | 2012-06-26 |
| 8044899 | Methods and apparatus for backlight calibration | Pak Hong Ng, Shou-Lung Chen | 2011-10-25 |
| 7892888 | Method and apparatus for stacking electrical components using via to provide interconnection | Chih-Wen Lin | 2011-02-22 |
| 7841739 | Total internal reflection side emitting coupling device | Ying Liu | 2010-11-30 |
| 7828472 | Light guiding strip and backlight module and display using the same | Ying Liu, Danding Huang | 2010-11-09 |
| 7755188 | Method and apparatus for stacking electrical components using via to provide interconnection | Chin-Wen Lin | 2010-07-13 |
| 7607792 | Light-emitting devices and lens therefor | Ying Liu, Danding Huang, Shou-Lung Chen | 2009-10-27 |
| 7521783 | Ultra thin image sensor package structure and method for fabrication | Chih-Wen Lin | 2009-04-21 |
| 7495327 | Chip stacking structure | Chih-Wen Lin | 2009-02-24 |
| 7462925 | Method and apparatus for stacking electrical components using via to provide interconnection | Chih-Wen Lin | 2008-12-09 |
| 7291927 | Dual chips stacked packaging structure | Chih-Wen Lin | 2007-11-06 |
| 7259042 | Ultra thin dual chip image sensor package structure and method for fabrication | Chih-Wen Lin | 2007-08-21 |
| 7227253 | Ultra thin dual chip image sensor package structure and method for fabrication | Chih-Wen Lin | 2007-06-05 |
| 7217995 | Apparatus for stacking electrical components using insulated and interconnecting via | Chih-Wen Lin | 2007-05-15 |
| 7122904 | Semiconductor packaging device and manufacture thereof | Jui-Chung Lee, Chih-Wen Lin | 2006-10-17 |
| 7102159 | Ultra thin image sensor package structure and method for fabrication | Chih-Wen Lin | 2006-09-05 |
| 7045888 | Ultra thin dual chip image sensor package structure and method for fabrication | Chih-Wen Lin | 2006-05-16 |
| 6977436 | Semiconductor packaging device | Jui-Chung Lee, Chih-Wen Lin | 2005-12-20 |
| 6972372 | Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection | Chih-Wen Lin | 2005-12-06 |
| 6650008 | Stacked semiconductor packaging device | Jui-Chung Lee, Chih-Wen Lin | 2003-11-18 |
| 6559526 | Multiple-step inner lead of leadframe | Jui-Chung Lee, Chih-Wen Lin | 2003-05-06 |