Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249108 | 3D image sensing device with 3D image processing function and 3D image processing method applied thereto | Hsiu-Wen Wang | 2025-03-11 |
| 11900743 | Security authentication method and security authentication device using same | Hsiu-Wen Wang | 2024-02-13 |
| 11582395 | Gimbal device | Hsiu-Wen Wang | 2023-02-14 |
| 11509888 | Method for aligning camera lens with light source | Hsiu-Wen Wang | 2022-11-22 |
| 11206378 | Camera module aligning method | Hsiu-Wen Wang | 2021-12-21 |
| 10958817 | Method for determining camera module assembling quality | Hsiu-Wen Wang | 2021-03-23 |
| 8558357 | Ultra thin image sensor package structure and method for fabrication | Chen-Jung Tsai | 2013-10-15 |
| 7892888 | Method and apparatus for stacking electrical components using via to provide interconnection | Chen-Jung Tsai | 2011-02-22 |
| 7521783 | Ultra thin image sensor package structure and method for fabrication | Chen-Jung Tsai | 2009-04-21 |
| 7495327 | Chip stacking structure | Chen-Jung Tsai | 2009-02-24 |
| 7462925 | Method and apparatus for stacking electrical components using via to provide interconnection | Chen-Jung Tsai | 2008-12-09 |
| 7291927 | Dual chips stacked packaging structure | Chen-Jung Tsai | 2007-11-06 |
| 7259042 | Ultra thin dual chip image sensor package structure and method for fabrication | Chen-Jung Tsai | 2007-08-21 |
| 7231565 | Method for performing built-in and at-speed test in system-on-chip | — | 2007-06-12 |
| 7227253 | Ultra thin dual chip image sensor package structure and method for fabrication | Chen-Jung Tsai | 2007-06-05 |
| 7217995 | Apparatus for stacking electrical components using insulated and interconnecting via | Chen-Jung Tsai | 2007-05-15 |
| 7213187 | Digital logic test method to systematically approach functional coverage completely and related apparatus and system | — | 2007-05-01 |
| 7122904 | Semiconductor packaging device and manufacture thereof | Chen-Jung Tsai, Jui-Chung Lee | 2006-10-17 |
| 7102159 | Ultra thin image sensor package structure and method for fabrication | Chen-Jung Tsai | 2006-09-05 |
| 7058557 | Method for functional verification of hardware design | — | 2006-06-06 |
| 7047433 | Method and circuit for synchronizing a higher frequency clock and a lower frequency clock | — | 2006-05-16 |
| 7045888 | Ultra thin dual chip image sensor package structure and method for fabrication | Chen-Jung Tsai | 2006-05-16 |
| 6977436 | Semiconductor packaging device | Chen-Jung Tsai, Jui-Chung Lee | 2005-12-20 |
| 6972372 | Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection | Chen-Jung Tsai | 2005-12-06 |
| 6650008 | Stacked semiconductor packaging device | Chen-Jung Tsai, Jui-Chung Lee | 2003-11-18 |