Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Shou-Lung Chen, Ching-Wen Hsaio, Yu-Hua Chen, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2017-03-21 |
| 9059181 | Wafer leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsaio, Yu-Hua Chen, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2015-06-16 |
| 8587091 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2013-11-19 |
| 8314482 | Semiconductor package device | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2012-11-20 |
| 7838333 | Electronic device package and method of manufacturing the same | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jyh-Rong Lin | 2010-11-23 |
| 7632707 | Electronic device package and method of manufacturing the same | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jyh-Rong Lin | 2009-12-15 |
| 7528009 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2009-05-05 |
| 7294920 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2007-11-13 |