Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114387 | Electronic packaging structure | Jing-Yao Chang, Tao-Chih Chang, Wei Han, Kuo-Shu Kao | 2021-09-07 |
| 10672677 | Semiconductor package structure | Jing-Yao Chang, Tao-Chih Chang, Kuo-Shu Kao, Hsin-Han Lin, Chih-Ming Tzeng +2 more | 2020-06-02 |
| 7572676 | Packaging structure and method of an image sensor module | Shou-Lung Chen, Ching-Wen Hsiao, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng +3 more | 2009-08-11 |
| 7544529 | Image sensor packaging structure and method of manufacturing the same | Shou-Lung Chen, Shan-Pu Yu | 2009-06-09 |
| 7417293 | Image sensor packaging structure | Shou-Lung Chen, Shan-Pu Yu | 2008-08-26 |
| 7411306 | Packaging structure and method of an image sensor module | Shou-Lung Chen, Ching-Wen Hsiao, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng +3 more | 2008-08-12 |
| 7091592 | Stacked package for electronic elements and packaging method thereof | Shou-Lung Chen, I-Hsuan Peng, Shan-Pu Yu | 2006-08-15 |
| 6166435 | Flip-chip ball grid array package with a heat slug | Rong-Shen Lee, Hsin-Chien Huang, Randy Lo, Chiang-Han Day | 2000-12-26 |
| 5243493 | Fanless convection cooling design for personal computers | Jian-Dih Jeng | 1993-09-07 |