Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6536653 | One-step bumping/bonding method for forming semiconductor packages | Hsing-Seng Wang, Rong-Shen Lee | 2003-03-25 |
| 6166435 | Flip-chip ball grid array package with a heat slug | Fang-Jun Leu, Rong-Shen Lee, Hsin-Chien Huang, Randy Lo | 2000-12-26 |