Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6590282 | Stacked semiconductor package formed on a substrate and method for fabrication | Rong-Shen Lee, Chia-Chung Wang | 2003-07-08 |
| 6536653 | One-step bumping/bonding method for forming semiconductor packages | Rong-Shen Lee, Chiang-Han Day | 2003-03-25 |
| 6479321 | One-step semiconductor stack packaging method | Rong-Shen Lee | 2002-11-12 |
| 6255140 | Flip chip chip-scale package | — | 2001-07-03 |
| 6207475 | Method for dispensing underfill and devices formed | Shih-Hsiung Lin | 2001-03-27 |
| 5977626 | Thermally and electrically enhanced PBGA package | Rong-Shen Lee, Pou-Huang Chen | 1999-11-02 |
| 5789270 | Method for assembling a heat sink to a die paddle | Jian-Dih Jeng | 1998-08-04 |
| 5783860 | Heat sink bonded to a die paddle having at least one aperture | Jian-Dih Jeng | 1998-07-21 |
| 5736785 | Semiconductor package for improving the capability of spreading heat | Cheng-Lien Chiang, Rong-Shen Lee | 1998-04-07 |
| 5672547 | Method for bonding a heat sink to a die paddle | Jian-Dih Jeng | 1997-09-30 |