Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9111774 | Wafer-to-wafer stack with supporting post | Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Wei-Chung Lo | 2015-08-18 |
| 8810031 | Wafer-to-wafer stack with supporting pedestal | Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Wei-Chung Lo | 2014-08-19 |
| 8280081 | Electrode connection structure of speaker unit | Yu-Min Lin, Chang-Ho Liou, Yu-Wei Huang, Ming-Daw Chen | 2012-10-02 |
| 8243966 | Assembly structure of a flat speaker | Yu-Min Lin, Chang-Ho Liou, Yu-Wei Huang, Ming-Daw Chen | 2012-08-14 |
| 8164165 | Wafer-to-wafer stack with supporting pedestal | Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Wei-Chung Lo | 2012-04-24 |
| 7948072 | Wafer-to-wafer stacking | Ra-Min Tain, Shu-Ming Chang, Shyi-Ching Liau, Wei-Chung Lo, Chi-Shih Chang | 2011-05-24 |
| 6590282 | Stacked semiconductor package formed on a substrate and method for fabrication | Hsing-Seng Wang, Chia-Chung Wang | 2003-07-08 |
| 6536653 | One-step bumping/bonding method for forming semiconductor packages | Hsing-Seng Wang, Chiang-Han Day | 2003-03-25 |
| 6479321 | One-step semiconductor stack packaging method | Hsing-Seng Wang | 2002-11-12 |
| 6459150 | Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer | Enboa Wu, Tsung-Yao Chu, Hsin-Chien Huang | 2002-10-01 |
| 6166435 | Flip-chip ball grid array package with a heat slug | Fang-Jun Leu, Hsin-Chien Huang, Randy Lo, Chiang-Han Day | 2000-12-26 |
| 5977626 | Thermally and electrically enhanced PBGA package | Hsing-Seng Wang, Pou-Huang Chen | 1999-11-02 |
| 5736785 | Semiconductor package for improving the capability of spreading heat | Cheng-Lien Chiang, Hsing-Seng Wang | 1998-04-07 |