| 6479323 |
Method for attaching a lead frame to a heat spreader/heat slug structure |
Boonmi Mekdhanasarn, Daniel P. Tracy |
2002-11-12 |
| 6414384 |
Package structure stacking chips on front surface and back surface of substrate |
Chien-Ping Huang, Chi-Chuan Wu |
2002-07-02 |
| 6166435 |
Flip-chip ball grid array package with a heat slug |
Fang-Jun Leu, Rong-Shen Lee, Hsin-Chien Huang, Chiang-Han Day |
2000-12-26 |
| 5891760 |
Lead frame with electrostatic discharge protection |
Boonmi Mekdhanasarn |
1999-04-06 |
| 5796570 |
Electrostatic discharge protection package |
Boonmi Mekdhanasarn, Steve M. Ichikawa, Abdul R. Ahmed |
1998-08-18 |
| 5773876 |
Lead frame with electrostatic discharge protection |
Boonmi Mekdhanasarn |
1998-06-30 |
| 5691567 |
Structure for attaching a lead frame to a heat spreader/heat slug structure |
Boonmi Mekdhanasarn, Daniel P. Tracy |
1997-11-25 |
| 5617297 |
Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards |
Hem Takiar |
1997-04-01 |