Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7940070 | Singulated bare die testing fixture | — | 2011-05-10 |
| 7871274 | IC adapter for removably mounting integrated circuit | — | 2011-01-18 |
| 7652894 | Contact lead | — | 2010-01-26 |
| 7622795 | Light emitting diode package | — | 2009-11-24 |
| 7508070 | Two dimensional stacking using interposers | — | 2009-03-24 |
| 7459385 | Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler | Charles W. C. Lin, Cheng-Chung Chen | 2008-12-02 |
| 7417314 | Semiconductor chip assembly with laterally aligned bumped terminal and filler | Charles W. C. Lin, Cheng-Chung Chen | 2008-08-26 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture | Charles W. C. Lin | 2007-08-28 |
| 7227249 | Three-dimensional stacked semiconductor package with chips on opposite sides of lead | — | 2007-06-05 |
| 7192803 | Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint | Charles W. C. Lin | 2007-03-20 |
| 7190060 | Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same | — | 2007-03-13 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal | Charles W. C. Lin | 2006-11-07 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar | Charles W. C. Lin | 2006-10-31 |
| 7129113 | Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture | Charles W. C. Lin | 2006-10-31 |
| 7112521 | Method of making a semiconductor chip assembly with a bumped metal pillar | Charles W. C. Lin | 2006-09-26 |
| 7071089 | Method of making a semiconductor chip assembly with a carved bumped terminal | Charles W. C. Lin | 2006-07-04 |
| 7067911 | Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture | Charles W. C. Lin | 2006-06-27 |
| 7015128 | Method of making a semiconductor chip assembly with an embedded metal particle | Charles W. C. Lin | 2006-03-21 |
| 7009309 | Semiconductor package device that includes an insulative housing with a protruding peripheral portion | — | 2006-03-07 |
| 7009297 | Semiconductor chip assembly with embedded metal particle | Charles W. C. Lin | 2006-03-07 |
| 6989584 | Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead | — | 2006-01-24 |
| 6989295 | Method of making a semiconductor package device that includes an insulative housing with first and second housing portions | — | 2006-01-24 |
| 6987034 | Method of making a semiconductor package device that includes singulating and trimming a lead | — | 2006-01-17 |
| 6984576 | Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip | Charles W. C. Lin | 2006-01-10 |
| 6949408 | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps | Charles W. C. Lin | 2005-09-27 |