Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955404 | Electronic package and heat dissipation structure thereof, comprising bonding pillars | Chien-Yu Chen, Wei-Hao Chen | 2024-04-09 |
| 10981787 | Oxygen generator | — | 2021-04-20 |
| 5789270 | Method for assembling a heat sink to a die paddle | Hsing-Seng Wang | 1998-08-04 |
| 5783860 | Heat sink bonded to a die paddle having at least one aperture | Hsing-Seng Wang | 1998-07-21 |
| 5672547 | Method for bonding a heat sink to a die paddle | Hsing-Seng Wang | 1997-09-30 |
| 5356216 | Apparatus for measuring heat of circuit module | — | 1994-10-18 |
| 5243493 | Fanless convection cooling design for personal computers | Fang-Jun Leu | 1993-09-07 |