Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1094288 | Power module | Yuan-Cheng Huang, Ji-Yuan Syu, Po-Kai Chiu | 2025-09-23 |
| 12381133 | Power semiconductor device | Tai-Jyun Yu, Sheng-Tsai Wu, Han-Lin Wu, Tai-Kuang Lee, Jing-Yao Chang | 2025-08-05 |
| 12349293 | Combined power module | Yuan-Cheng Huang, I-Hung Chiang, Ji-Yuan Syu, Hsin-Han Lin, Po-Kai Chiu | 2025-07-01 |
| 11776867 | Chip package | Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2023-10-03 |
| D976852 | Power module | Sheng-Tsai Wu, Hsin-Han Lin, Yuan-Yin Lo, Tai-Jyun Yu, Han-Lin Wu +1 more | 2023-01-31 |
| 11387159 | Chip package | Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2022-07-12 |
| 11114387 | Electronic packaging structure | Jing-Yao Chang, Tao-Chih Chang, Fang-Jun Leu, Wei Han | 2021-09-07 |
| 10672677 | Semiconductor package structure | Jing-Yao Chang, Tao-Chih Chang, Fang-Jun Leu, Hsin-Han Lin, Chih-Ming Tzeng +2 more | 2020-06-02 |
| 10622274 | Chip package | Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2020-04-14 |
| 10490478 | Chip packaging and composite system board | Yu-Min Lin, Jing-Yao Chang, Tao-Chih Chang | 2019-11-26 |
| 9308603 | Solder, solder joint structure and method of forming solder joint structure | Tao-Chih Chang, Wen-Chih Chen | 2016-04-12 |
| 9161455 | Method of fabricating of circuit board | Ngai Tsang | 2015-10-13 |
| 8466374 | Base for circuit board, circuit board, and method of fabricating thereof | Ngai Tsang | 2013-06-18 |
| 7932600 | Electrical connecting structure and bonding structure | Ngai Tsang | 2011-04-26 |