Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454566 | Parameter similarity method for test simulation conditions of aerodynamic heating environment | Dechuan Sun | 2022-09-27 |
| 9401825 | Apparatus and method for channel estimation | Chi-Tien Sun | 2016-07-26 |
| 8549386 | Pre-decoded tail-biting convolutional code decoder and decoding method thereof | Chi-Tien Sun | 2013-10-01 |
| 8332450 | Method of CORDIC computing vector angle and electronic apparatus using the same | — | 2012-12-11 |
| 7329563 | Method for fabrication of wafer level package incorporating dual compliant layers | Wei-Chung Lo, Hsin-Chien Huang | 2008-02-12 |
| 6914333 | Wafer level package incorporating dual compliant layers and method for fabrication | Wei-Chung Lo, Hsin-Chien Huang | 2005-07-05 |
| 6605525 | Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and package formed | Szu-Wei Lu, Jyh-Rong Lin | 2003-08-12 |
| 6596611 | Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed | Szu-Wei Lu | 2003-07-22 |