Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9973180 | Output stage circuit | Yen-Chung Huang | 2018-05-15 |
| 9244161 | Ultrasound transmission circuit and time delay calibration method thereof | Yu-Te Kao | 2016-01-26 |
| 8136070 | Shallow trench isolation dummy pattern and layout method using the same | Kelvin Yih-Yuh Doong | 2012-03-13 |
| 7849432 | Shallow trench isolation dummy pattern and layout method using the same | Kelvin Yih-Yuh Doong | 2010-12-07 |
| 7777338 | Seal ring structure for integrated circuit chips | Chih-Hsiang Yao, Tai-Chun Huang, Kuan-Shou Chi, Chih-Cherng Jeng, Ming-Shuoh Liang +1 more | 2010-08-17 |
| 7592710 | Bond pad structure for wire bonding | Chih-Hsiang Yao, Tai-Chun Huang, Chih-Tang Peng | 2009-09-22 |
| 7470994 | Bonding pad structure and method for making the same | Tai-Chun Huang, Chih-Hsiang Yao | 2008-12-30 |
| 7388263 | Shallow trench isolation dummy pattern and layout method using the same | Kelvin Yih-Yuh Doong | 2008-06-17 |
| 7312486 | Stripe board dummy metal for reducing coupling capacitance | Kang-Cheng Lin | 2007-12-25 |
| 7291557 | Method for forming an interconnection structure for ic metallization | Wen-Kai Wan | 2007-11-06 |
| 7253531 | Semiconductor bonding pad structure | Tai-Chun Huang, Chih-Hsiang Yao, Kuan-Shou Chi, Ming-Ta Lei | 2007-08-07 |
| 7151052 | Multiple etch-stop layer deposition scheme and materials | Tai-Chun Huang, Chih-Hsiang Yao, Kuan-Shou Chi, Mong-Song Liang | 2006-12-19 |
| 7042097 | Structure for reducing stress-induced voiding in an interconnect of integrated circuits | Chih-Hsiang Yao, Wen-Kai Wan | 2006-05-09 |
| 6835578 | Test structure for differentiating the line and via contribution in stress migration | Li-Te Lin | 2004-12-28 |
| 6831365 | Method and pattern for reducing interconnect failures | Chih-Hsiang Yao, Wen-Kai Wan, Tai-Chun Huang | 2004-12-14 |
| 6737345 | Scheme to define laser fuse in dual damascene CU process | Kang-Cheng Lin | 2004-05-18 |
| 6566752 | Bonding pad and method for manufacturing it | Bing-Yue Tsui, Tsung-Ju Yang, Tsung-Yao Chu | 2003-05-20 |
| 6426555 | Bonding pad and method for manufacturing it | Bing-Yue Tsui, Tsung-Ju Yang, Tsung-Yao Chu | 2002-07-30 |
| 6361909 | Illumination aperture filter design using superposition | Tsai-Sheng Gau | 2002-03-26 |