Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348828 | Interconnect structure and method of forming the same | Jye-Yen Cheng, Chen-Yu Shyu | 2022-05-31 |
| 10522396 | Methods of fabricating integrated circuit devices having reduced line end spaces | Jye-Yen Cheng, Chen-Yu Shyu | 2019-12-31 |
| 7777338 | Seal ring structure for integrated circuit chips | Chih-Hsiang Yao, Tai-Chun Huang, Kuan-Shou Chi, Chih-Cherng Jeng, Wen-Kai Wan +1 more | 2010-08-17 |
| 6234029 | Testing module for testing the strength of the welding area on a PCB | Sung-Ching Hung, Hung-Nan Chen, Simon Lee | 2001-05-22 |