BT

Bing-Yue Tsui

IT ITRI: 9 patents #616 of 9,619Top 7%
ET Episil Technologies: 4 patents #3 of 24Top 15%
NU National Chiao Tung University: 4 patents #114 of 1,517Top 8%
NU National Yang Ming Chiao Tung University: 2 patents #38 of 406Top 10%
NC National Science Council: 1 patents #238 of 867Top 30%
Overall (All Time): #200,989 of 4,157,543Top 5%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
12408372 Process method for fabricating a three-dimensional source contact structure Jui-Cheng Wang, Li-Tien Hsueh, Jui-Tse Hsiao 2025-09-02
12256559 Source-body self-aligned method of a vertical double diffused metal oxide semiconductor field effect transistor Jui-Cheng Wang 2025-03-18
11538920 Method for increasing an oxide thickness at trench corner of an U-shaped gate metal-oxide-semiconductor field-effect transistor Fang-Hsin Lu, Yi-Ting Shih 2022-12-27
11342417 Semiconductor structure of trench transistors and manufacturing method thereof Fang-Hsin Lu 2022-05-24
8853824 Enhanced tunnel field effect transistor Pei-Yu Wang 2014-10-07
7517759 Method of fabricating metal oxide semiconductor device 2009-04-14
7391079 Metal oxide semiconductor device 2008-06-24
7294550 Method of fabricating metal oxide semiconductor device 2007-11-13
7115526 Method for wet etching of high k thin film at low temperature Hsieh Yue Ho, Chih-Cheng Wang, Hsiao Shih-Yi, Kang Tsung-Kuei, Chih-Feng Huang +4 more 2006-10-03
6835611 Structure of metal oxide semiconductor field effect transistor Chih-Feng Huang 2004-12-28
6759305 Method for increasing the capacity of an integrated circuit device Chun-Tao Lee, Cheng-Chung Lee 2004-07-06
6566752 Bonding pad and method for manufacturing it Chin-Chiu Hsia, Tsung-Ju Yang, Tsung-Yao Chu 2003-05-20
6489204 Save MOS device 2002-12-03
6426555 Bonding pad and method for manufacturing it Chin-Chiu Hsia, Tsung-Ju Yang, Tsung-Yao Chu 2002-07-30
6303419 Method for fabricating a BiCMOS device featuring twin wells and an N type epitaxial layer Kuan-Lun Chang 2001-10-16
6225211 Method for making stacked and borderless via structures on semiconductor substrates for integrated circuits 2001-05-01
5959309 Sensor to monitor plasma induced charging damage Tzung-Zu Yang 1999-09-28
5891799 Method for making stacked and borderless via structures for multilevel metal interconnections on semiconductor substrates 1999-04-06
5792699 Method for reduction of reverse short channel effect in MOSFET 1998-08-11
5702566 Conductive photoresist to mitigate antenna effect 1997-12-30
5024954 Method of improving high temperature stability of PTSI/SI structure Mao-Chieh Chen, Jiunn-Yann Tsai 1991-06-18