Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051672 | Package structure and method of forming the same | Yi-Hsiu Chen, Ebin Liao, Hong-Ye Shih, Wen-Chih Chiou | 2024-07-30 |
| 10672737 | Three-dimensional integrated circuit structure and method of manufacturing the same | Yi-Hsiu Chen, Ebin Liao, Hong-Ye Shih, Wen-Chih Chiou | 2020-06-02 |