Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8841773 | Multi-layer interconnect structure for stacked dies | Chien-Ming Chiu, Tsang-Jiuh Wu, Shau-Lin Shue, Chen-Hua Yu | 2014-09-23 |
| 8836085 | Cost-effective TSV formation | Ku-Feng Yang, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2014-09-16 |
| 8580682 | Cost-effective TSV formation | Ku-Feng Yang, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2013-11-12 |
| 8513119 | Method of forming bump structure having tapered sidewalls for stacked dies | Kuo-Ching Hsu, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2013-08-20 |
| 8507940 | Heat dissipation by through silicon plugs | Chen-Hua Yu, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2013-08-13 |
| 8476116 | Reduction of etch microloading for through silicon vias | Chen-Hua Yu | 2013-07-02 |
| 8466059 | Multi-layer interconnect structure for stacked dies | Chien-Ming Chiu, Tsang-Jiuh Wu, Shau-Lin Shue, Chen-Hua Yu | 2013-06-18 |
| 8445296 | Apparatus and methods for end point determination in reactive ion etching | Chien Rhone Wang, Tzu-Cheng Lin, Yu-Jen Cheng, Chih-Wei Lai, Tsang-Jiuh Wu | 2013-05-21 |
| 8329578 | Via structure and via etching process of forming the same | Wen-Chih Chiou, Chen-Hua Yu | 2012-12-11 |
| 8319336 | Reduction of etch microloading for through silicon vias | Chen-Hua Yu | 2012-11-27 |
| 8074346 | Method of fabricating a radio frequency (RF) microelectromechanical system (MEMS) asymmetrical switch | Jiangyuan Qian, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li | 2011-12-13 |
| 7884689 | MEMS fabrication on a laminated substrate | Bedri A. Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Franco De Flaviis | 2011-02-08 |
| 7541898 | High isolation tunable MEMS capacitive switch | Jiangyuan Qian, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li | 2009-06-02 |
| 7265647 | High isolation tunable MEMS capacitive switch | Jiangyuan Qian, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li | 2007-09-04 |
| 7084724 | MEMS fabrication on a laminated substrate | Bedri A. Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Franco De Flaviis | 2006-08-01 |