Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297607 | Non-volatile memory having discrete isolation structure and SONOS memory cell, method of operating the same, and method of manufacturing the same | Takao Akaogi, Yider Wu | 2019-05-21 |
| 10269761 | Semiconductor device and method | Cheng-Chun Tsai, Hung-Pin Chang, Ku-Feng Yang, Wen-Chih Chiou | 2019-04-23 |
| 10269741 | Bond structures and the methods of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Ming-Fa Chen | 2019-04-23 |
| 10170396 | Through via structure extending to metallization layer | Ku-Feng Yang, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2019-01-01 |
| 10163709 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Ku-Feng Yang, Wen-Chih Chiou | 2018-12-25 |
| 10163623 | Etch method with surface modification treatment for forming semiconductor structure | Andrew Joseph Kelly | 2018-12-25 |
| 9972779 | Resistive random access memory | Frederick Chen, Ping Wang, Shao-Ching Liao, Po-Yen Hsu, Ting-Ying Shen +2 more | 2018-05-15 |
| 9960349 | Resistive random-access memory structure and method for fabricating the same | Ming-Hung Hsieh, Po-Yen Hsu, Ting-Ying Shen | 2018-05-01 |
| 9893028 | Bond structures and the methods of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Ming-Fa Chen | 2018-02-13 |
| 9842823 | Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate | Chen-Hua Yu, HsiaoYun Lo, Wen-Chih Chiou | 2017-12-12 |
| 9754831 | Dummy structure for chip-on-wafer-on-substrate | Pei-Ching Kuo, Jun-Lin Yeh, Yung-Chi Lin, Li-Han Hsu, Wei-Cheng Wu +2 more | 2017-09-05 |
| 9601410 | Semiconductor device and method | Cheng-Chun Tsai, Hung-Pin Chang, Ku-Feng Yang, Wen-Chih Chiou | 2017-03-21 |
| 9583465 | Three dimensional integrated circuit structure and manufacturing method of the same | Kuang-Wei Cheng, Ku-Feng Yang, Wen-Chih Chiou | 2017-02-28 |
| 9425126 | Dummy structure for chip-on-wafer-on-substrate | Pei-Ching Kuo, Jun-Lin Yeh, Yung-Chi Lin, Li-Han Hsu, Wei-Cheng Wu +2 more | 2016-08-23 |
| 9418933 | Through-substrate via formation with improved topography control | Yung-Chi Lin, Ku-Feng Yang, Wen-Chih Chiou | 2016-08-16 |
| 9263382 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Tsang-Jiuh Wu, Ebin Liao, Yuan-Hung Liu, Wen-Chih Chiou | 2016-02-16 |
| 9064850 | Through-substrate via formation with improved topography control | Yung-Chi Lin, Ku-Feng Yang, Wen-Chih Chiou | 2015-06-23 |
| 8803322 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Tsang-Jiuh Wu, Ebin Liao, Yuan-Hung Liu, Wen-Chih Chiou | 2014-08-12 |
| 8158519 | Method of manufacturing non-volatile memory cell using self-aligned metal silicide | Yung-Chung Lee, Yider Wu | 2012-04-17 |
| 8012825 | Method of manufacturing the double-implant nor flash memory structure | Yider Wu, Yung-Chung Lee | 2011-09-06 |