Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406869 | Systems and methods for humidity control of FOUP during semiconductor fabrication | Sung-Ju Huang, Cheng-Lung Wu, Yi-Fam Shiu, Chyi-Tsong Ni | 2025-09-02 |
| 12400996 | Heterogenous bonding layers for direct semiconductor bonding | Chyi-Tsong Ni | 2025-08-26 |
| 12368062 | Reflector and/or method for ultraviolet curing of semiconductor | Chien-Chun Hu, Chyi-Tsong Ni | 2025-07-22 |
| 12347772 | Semiconductor devices and methods of manufacturing thereof | Chyi-Tsong Ni | 2025-07-01 |
| 12325913 | Deflector for chamber cleaning | Sung-Ju Huang, Yung-Tsun Liu, Chih-Tsung Lee, Chyi-Tsong Ni | 2025-06-10 |
| 12276024 | Device and methods for chemical vapor deposition | Yung-Tsun Liu, Sung-Ju Huang, Chih-Tsung Lee, Chyi-Tsong Ni | 2025-04-15 |
| 12205921 | Heterogenous bonding layers for direct semiconductor bonding | Chyi-Tsong Ni | 2025-01-21 |
| 12194510 | Method and apparatus for semiconductor wafer | Cheng-Lung Wu, Chyi-Tsong Ni | 2025-01-14 |
| 12172117 | Laminar gas flow filter | Jyh-Shiou Hsu, Wen-Hsun Tsai, Chien-Chun Hu, Sung-Ju Huang | 2024-12-24 |
| 12131962 | Semiconductor processing tool and methods of operation | Yung-Tsun Liu, Chih-Tsung Lee, Chyi-Tsong Ni | 2024-10-29 |
| 12094849 | Atomic layer deposition bonding layer for joining two semiconductor devices | Chyi-Tsong Ni | 2024-09-17 |
| 12084769 | Semiconductor processing tool | Yung-Tsun Liu, Sheng-chun Yang, Chih-Tsung Lee, Chyi-Tsong Ni | 2024-09-10 |
| 12068363 | Structure formation in a semiconductor device | Chyi-Tsong Ni | 2024-08-20 |
| 12051609 | Systems and methods for humidity control of FOUP during semiconductor fabrication | Sung-Ju Huang, Cheng-Lung Wu, Yi-Fam Shiu, Chyi-Tsong Ni | 2024-07-30 |
| 11938521 | Method and apparatus for semiconductor wafer cleaning | Cheng-Lung Wu, Chyi-Tsong Ni | 2024-03-26 |
| 11929267 | Reflector and/or method for ultraviolet curing of semiconductor | Chien-Chun Hu, Chyi-Tsong Ni | 2024-03-12 |
| 11851761 | Semiconductor processing tool | Yung-Tsun Liu, Sheng-chun Yang, Chih-Tsung Lee, Chyi-Tsong Ni | 2023-12-26 |
| 10153338 | Method of manufacturing a capacitor | Chun Hua Chang, Der-Chyang Yeh, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2018-12-11 |
| 9660016 | Method of manufacturing a capacitor | Chun Hua Chang, Der-Chyang Yeh, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2017-05-23 |
| 9583465 | Three dimensional integrated circuit structure and manufacturing method of the same | Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2017-02-28 |
| 9565042 | Ultra-low power transmitter applied in multi-channel frequency shift (FSK) communication | Wen-Hao Ho, Sheng-Kai Chang | 2017-02-07 |
| 9479115 | Duplexer and cable modem using a duplexer | CHUN-FA LIAO | 2016-10-25 |
| 9231596 | Method and apparatus for a duty-cycled harmonic injection locked oscillator | Zhiming CHEN, Yuanjin Zheng, Minkyu Je | 2016-01-05 |
| 8878338 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Der-Chyang Yeh, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2014-11-04 |
| 8691706 | Reducing substrate warpage in semiconductor processing | Chen-Hua Yu, Wen-Chih Chiou, Fang Wen Tsai, Jiann Sheng Chang, Yi Chou Lai +1 more | 2014-04-08 |