Issued Patents All Time
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425126 | Dummy structure for chip-on-wafer-on-substrate | Pei-Ching Kuo, Yi-Hsiu Chen, Jun-Lin Yeh, Yung-Chi Lin, Li-Han Hsu +2 more | 2016-08-23 |
| 9418933 | Through-substrate via formation with improved topography control | Yung-Chi Lin, Yi-Hsiu Chen, Wen-Chih Chiou | 2016-08-16 |
| 9373575 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Tsang-Jiuh Wu, Jing-Cheng Lin | 2016-06-21 |
| 9343390 | TSV formation processes using TSV-last approach | Jing C. Lin, Yung-Chi Lin | 2016-05-17 |
| 9293366 | Through-substrate vias with improved connections | Jing-Cheng Lin | 2016-03-22 |
| 9293418 | Backside through vias in a bonded structure | Weng-Jin Wu, Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2016-03-22 |
| 9263382 | Through substrate via structures and methods of forming the same | Tsang-Jiuh Wu, Yi-Hsiu Chen, Ebin Liao, Yuan-Hung Liu, Wen-Chih Chiou | 2016-02-16 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2016-02-02 |
| 9190325 | TSV formation | Shin-Puu Jeng, Wen-Chih Chiou | 2015-11-17 |
| 9117828 | Method of handling a thin wafer | Weng-Jin Wu, Wen-Chih Chiou | 2015-08-25 |
| 9064850 | Through-substrate via formation with improved topography control | Yung-Chi Lin, Yi-Hsiu Chen, Wen-Chih Chiou | 2015-06-23 |
| 9059262 | Integrated circuits including conductive structures through a substrate and methods of making the same | Yuan-Hung Liu, Pei-Ching Kuo, Ming-Tsu Chung, Hsin-Yu Chen, Tsang-Jiuh Wu +1 more | 2015-06-16 |
| 9006101 | Interconnect structure and method | Hsin-Yu Chen, Tasi-Jung Wu, Lin-Chih Huang, Yuan-Hung Liu, Tsang-Jiuh Wu +1 more | 2015-04-14 |
| 8956966 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Tsang-Jiuh Wu, Jing-Cheng Lin | 2015-02-17 |
| 8836085 | Cost-effective TSV formation | Yung-Chi Lin, Hung-Pin Chang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2014-09-16 |
| 8803322 | Through substrate via structures and methods of forming the same | Tsang-Jiuh Wu, Yi-Hsiu Chen, Ebin Liao, Yuan-Hung Liu, Wen-Chih Chiou | 2014-08-12 |
| 8803316 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Tsang-Jiuh Wu, Jing-Cheng Lin | 2014-08-12 |
| 8691664 | Backside process for a substrate | Weng-Jin Wu, Wen-Chih Chiou, Jung-Chih Hu | 2014-04-08 |
| 8673775 | Methods of forming semiconductor structures | Wen-Chih Chiou, Tsang-Jiuh Wu, Hsin-Yu Chen | 2014-03-18 |
| 8664749 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Hung-Jung Tu, Jung-Chih Hu, Wen-Chih Chiou | 2014-03-04 |
| 8629042 | Method for stacking semiconductor dies | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2014-01-14 |
| 8629565 | Thin wafer protection device | Weng-Jin Wu, Wen-Chih Chiou, Tsung-Ding Wang | 2014-01-14 |
| 8587127 | Semiconductor structures and methods of forming the same | Wen-Chih Chiou, Tsang-Jiuh Wu, Hsin-Yu Chen | 2013-11-19 |
| 8580682 | Cost-effective TSV formation | Yung-Chi Lin, Hung-Pin Chang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2013-11-12 |
| 8500182 | Vacuum wafer carriers for strengthening thin wafers | Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou, Chen-Hua Yu | 2013-08-06 |