Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8405225 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Hung-Jung Tu | 2013-03-26 |
| 8362593 | Method for stacking semiconductor dies | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2013-01-29 |
| 8338939 | TSV formation processes using TSV-last approach | Jing-Cheng Lin, Yung-Chi Lin | 2012-12-25 |
| 8252682 | Method for thinning a wafer | Weng-Jin Wu, Hsin-Hsien Lu, Chia-Lin Yu, Chu-Sung Shih, Fu-Chi Hsu +1 more | 2012-08-28 |
| 8232140 | Method for ultra thin wafer handling and processing | Weng-Jin Wu, Wen-Chih Chiou, Tsung-Ding Wang | 2012-07-31 |
| 8148826 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Hung-Jung Tu | 2012-04-03 |
| 8119500 | Wafer bonding | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2012-02-21 |
| 8058150 | Particle free wafer separation | Weng-Jin Wu, Jung-Chih Hu, Wen-Chih Chiou, Chen-Hua Yu | 2011-11-15 |
| 8053277 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Hung-Jung Tu | 2011-11-08 |
| 7989318 | Method for stacking semiconductor dies | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2011-08-02 |
| 7972969 | Method and apparatus for thinning a substrate | Wen-Chih Chiou, Weng-Jin Wu, Kewei Zuo | 2011-07-05 |
| 7955895 | Structure and method for stacked wafer fabrication | Wen-Chih Chiou, Weng-Jin Wu, Hung-Jung Tu | 2011-06-07 |
| 7951647 | Performing die-to-wafer stacking by filling gaps between dies | Wen-Chih Chiou, Weng-Jin Wu, Ming-Chung Sung | 2011-05-31 |
| 7943421 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Hung-Jung Tu, Jung-Chih Hu, Wen-Chih Chiou | 2011-05-17 |
| 7812459 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Hung-Jung Tu | 2010-10-12 |