Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6430458 | Semi-selective chemical vapor deposition | Liang-Yuh Chen, Ted Guo | 2002-08-06 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Ashok Sinha, Zheng Xu, Liang Chen, Daniel Carl +3 more | 2002-04-16 |
| 6355560 | Low temperature integrated metallization process and apparatus | Hong Mei Zhang, Fusen Chen, Ted Guo | 2002-03-12 |
| 6297147 | Plasma treatment for ex-situ contact fill | Lisa Yang, Anish Tolia | 2001-10-02 |
| 6251758 | Construction of a film on a semiconductor wafer | Chyi Chern, Michal Danek, Marvin Liao, Karl A. Littau, Ivo Raaijmakers +1 more | 2001-06-26 |
| 6207222 | Dual damascene metallization | Liang-Yuh Chen, Rong Tao, Ted Guo | 2001-03-27 |
| 6169030 | Metallization process and method | Mehul Naik, Ted Guo, Liang-Yuh Chen, Israel Beinglass | 2001-01-02 |
| 6139905 | Integrated CVD/PVD Al planarization using ultra-thin nucleation layers | Liang-Yuh Chen, Mehul Naik, Ted Guo | 2000-10-31 |
| 6139697 | Low temperature integrated via and trench fill process and apparatus | Liang-Yuh Chen, Fusen Chen, Rong Tao, Ted Guo | 2000-10-31 |
| 6120844 | Deposition film orientation and reflectivity improvement using a self-aligning ultra-thin layer | Liang-Yuh Chen, Ted Guo, Fusen Chen | 2000-09-19 |
| 6107192 | Reactive preclean prior to metallization for sub-quarter micron application | Suchitra Subrahmanyan, Liang-Yuh Chen | 2000-08-22 |
| 6080665 | Integrated nitrogen-treated titanium layer to prevent interaction of titanium and aluminum | Liang-Yuh Chen, Ted Guo | 2000-06-27 |
| 6077781 | Single step process for blanket-selective CVD aluminum deposition | Ted Guo, Liang-Yuh Chen, Mehul Naik | 2000-06-20 |
| 6071572 | Forming tin thin films using remote activated specie generation | Jim Van Gogh, Karl A. Littau | 2000-06-06 |
| 6066358 | Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer | Ted Guo, Liang-Yuh Chen, Fusen Chen | 2000-05-23 |
| 6017144 | Method and apparatus for depositing highly oriented and reflective crystalline layers using a low temperature seeding layer | Ted Guo, Mehul Naik, Liang Chen, Israel Beinglass | 2000-01-25 |
| 6001420 | Semi-selective chemical vapor deposition | Liang-Yuh Chen, Ted Guo | 1999-12-14 |
| 5989623 | Dual damascene metallization | Liang-Yuh Chen, Rong Tao, Ted Guo | 1999-11-23 |
| 5989999 | Construction of a tantalum nitride film on a semiconductor wafer | Timothy E. Levine, Ling Chen, Mei Chang, Karl A. Littau, Ivo Raaijmakers | 1999-11-23 |
| 5943600 | Treatment of a titanium nitride layer to improve resistance to elevated temperatures | Kenny King-Tai Ngan | 1999-08-24 |
| 5877087 | Low temperature integrated metallization process and apparatus | Hong Mei Zhang, Fusen Chen, Ted Guo | 1999-03-02 |
| 5804046 | Thin-film forming apparatus | Susumu Sawada, Junichi Anan, Yoshitaka Kakutani, Hironori Wada, Fumihiko Yanagawa | 1998-09-08 |
| 5431799 | Collimation hardware with RF bias rings to enhance sputter and/or substrate cavity ion generation efficiency | Ivo Raaijmakers, Hiroji Hanawa | 1995-07-11 |
| 5108569 | Process and apparatus for forming stoichiometric layer of a metal compound by closed loop voltage controlled reactive sputtering | Haim Gilboa, Hiroji Hanawa | 1992-04-28 |
| 4756810 | Deposition and planarizing methods and apparatus | Lawrence T. Lamont, Jr., Timothy McEntee | 1988-07-12 |