Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6905965 | Reactive preclean prior to metallization for sub-quarter micron application | Liang-Yuh Chen, Roderick C. Mosely | 2005-06-14 |
| 6693030 | Reactive preclean prior to metallization for sub-quarter micron application | Liang-Yuh Chen, Roderick C. Mosely | 2004-02-17 |
| 6518176 | Method of selective formation of a barrier layer for a contact level via | Ted Guo, Liang-Yuh Chen, Roderick C. Mosely | 2003-02-11 |
| 6110828 | In-situ capped aluminum plug (CAP) process using selective CVD AL for integrated plug/interconnect metallization | Ted Guo, Liang-Yuh Chen | 2000-08-29 |
| 6107192 | Reactive preclean prior to metallization for sub-quarter micron application | Liang-Yuh Chen, Roderick C. Mosely | 2000-08-22 |