Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7859855 | Module and mounted structure using the same | Seiichi Nakatani | 2010-12-28 |
| 7667974 | Module and mounted structure using the same | Seiichi Nakatani | 2010-02-23 |
| 7151306 | Electronic part, and electronic part mounting element and an process for manufacturing such the articles | Takashi Kitae, Yukihiro Ishimaru, Hiroaki Takezawa | 2006-12-19 |
| 6853074 | Electronic part, an electronic part mounting element and a process for manufacturing such the articles | Takashi Kitae, Yukihiro Ishimaru, Hiroaki Takezawa | 2005-02-08 |
| 6814893 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure | Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tousaku Nishiyama | 2004-11-09 |
| 6756663 | Semiconductor device including wiring board with three dimensional wiring pattern | Tsukasa Shiraishi, Kazuyoshi Amami, Yoshihiro Bessho | 2004-06-29 |
| 6749774 | Conductive adhesive and connection structure using the same | Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru | 2004-06-15 |
| 6749889 | Method for producing mounting structure for an electronic component | Hiroaki Takezawa, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda | 2004-06-15 |
| 6675474 | Electronic component mounted member and repair method thereof | Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki | 2004-01-13 |
| 6666994 | Conductive adhesive and packaging structure using the same | Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tousaku Nishiyama | 2003-12-23 |
| 6620345 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure | Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tousaku Nishiyama | 2003-09-16 |
| 6569512 | Mounting structure for an electronic component and method for producing the same | Hiroaki Takezawa, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda | 2003-05-27 |
| 6524721 | Conductive adhesive and packaging structure using the same | Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tousaku Nishiyama | 2003-02-25 |
| 6525414 | Semiconductor device including a wiring board and semiconductor elements mounted thereon | Tsukasa Shiraishi, Kazuyoshi Amami, Yoshihiro Bessho | 2003-02-25 |
| 6521144 | Conductive adhesive and connection structure using the same | Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru | 2003-02-18 |
| 6512183 | Electronic component mounted member and repair method thereof | Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki | 2003-01-28 |
| 6510059 | Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module | Yukihiro Ishimaru, Takashi Kitae, Hiroaki Takezawa | 2003-01-21 |
| 6376051 | Mounting structure for an electronic component and method for producing the same | Hiroaki Takezawa, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda | 2002-04-23 |
| 6042953 | Substrate on which bumps are formed and method of forming the same | Kazufumi Yamaguchi, Mitsuo Asabe | 2000-03-28 |
| 5914274 | Substrate on which bumps are formed and method of forming the same | Kazufumi Yamaguchi, Mitsuo Asabe | 1999-06-22 |
| 5674573 | Method of synthesizing diamond-like carbon thin films | Hirokazu Nakaue, Hideo Kurokawa | 1997-10-07 |
| 5378285 | Apparatus for forming a diamond-like thin film | Hideo Kurokawa, Hirokazu Nakaue | 1995-01-03 |
| 5370292 | Magnetic tape driving mechanism having a capstan with a surface made of carbon film including diamond-bonded carbons | Hideo Kurokawa, Hirokazu Nakaue, Hideaki Yoshio, Hideyuki Hashi, Yuji Nakamura | 1994-12-06 |
| 5360483 | Plasma CVD apparatus and method therefor | Hideo Kurokawa, Hirokazu Nakaue | 1994-11-01 |
| 5203924 | Method of and apparatus for synthesizing diamondlike thin film | Hirokazu Nakaue, Hideo Kurokawa | 1993-04-20 |