Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7640654 | Electronic component transporting method | Seiichi Nakatani, Seiji Karashima | 2010-01-05 |
| 7638883 | Flip chip mounting method and bump forming method | Seiji Karashima, Seiichi Nakatani | 2009-12-29 |
| 7611040 | Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition | Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu, Yoshihisa Yamashita | 2009-11-03 |
| 7537961 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiichi Nakatani, Seiji Karashima, Susumu Sawada | 2009-05-26 |
| 7531387 | Flip chip mounting method and bump forming method | Seiji Karashima, Seiichi Nakatani | 2009-05-12 |
| 7531385 | Flip chip mounting method and method for connecting substrates | Seiji Karashima, Seiichi Nakatani | 2009-05-12 |
| 7151306 | Electronic part, and electronic part mounting element and an process for manufacturing such the articles | Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa | 2006-12-19 |
| 6916433 | Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same | Tsutomi Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Yasuhiro Suzuki | 2005-07-12 |
| 6853074 | Electronic part, an electronic part mounting element and a process for manufacturing such the articles | Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa | 2005-02-08 |
| 6814893 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2004-11-09 |
| 6749774 | Conductive adhesive and connection structure using the same | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani | 2004-06-15 |
| 6675474 | Electronic component mounted member and repair method thereof | Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Yasuhiro Suzuki | 2004-01-13 |
| 6666994 | Conductive adhesive and packaging structure using the same | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-12-23 |
| 6620345 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-09-16 |
| 6524721 | Conductive adhesive and packaging structure using the same | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-02-25 |
| 6521144 | Conductive adhesive and connection structure using the same | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani | 2003-02-18 |
| 6512183 | Electronic component mounted member and repair method thereof | Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Yasuhiro Suzuki | 2003-01-28 |
| 6510059 | Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module | Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa | 2003-01-21 |