Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8226400 | Die for molding honeycomb structure and manufacturing method thereof | Seiichi Inoue, Haremi Ito, Keiji Matsumoto | 2012-07-24 |
| 8115109 | Circuit board and method for jointing circuit board | Masayoshi Koyama, Norihito Tsukahara | 2012-02-14 |
| 7905011 | Bump forming method and bump forming apparatus | Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Takashi Kitae, Masayoshi Koyama | 2011-03-15 |
| 7670644 | Die for molding honeycomb structure and manufacturing method thereof | Seiichi Inoue, Haremi Ito, Keiji Matsumoto | 2010-03-02 |
| 7488895 | Method for manufacturing component built-in module, and component built-in module | Yoshitake Hayashi, Masayoshi Koyama, Satoru Yuhaku, Kazuo Otani, Yasushi Taniguchi +1 more | 2009-02-10 |
| 7384258 | Die for forming honeycomb structure, and method of manufacturing the same | Hiroshi Kuwahara, Takao Saito | 2008-06-10 |
| 7074279 | Method for removing titanium based coating film or oxide of titanium | Keiji Matsumoto, Yuji Asai | 2006-07-11 |
| 6691409 | Method of producing a circuit board | Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Satoru Tomekawa, Yasuhiro Nakatani +3 more | 2004-02-17 |
| 6518514 | Circuit board and production of the same | Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Satoru Tomekawa, Yasuhiro Nakatani +3 more | 2003-02-11 |
| 5865220 | Apparatus for filling liquid crystal material | Chihiro Nakamura, Kiyohiko Kitagawa, Takafumi Kaneda, Tsukasa Hashimoto, Tomoya Maeda | 1999-02-02 |
| 5862839 | Method and apparatus for filling liquid crystal material | Chihiro Nakamura, Kiyohiko Kitagawa, Takafumi Kaneda, Tsukasa Hashimoto, Tomoya Maeda | 1999-01-26 |
| 5229915 | Power semiconductor device with heat dissipating property | Chihiro Ishibashi, Hiroyuki Abe | 1993-07-20 |
| 4456232 | Apparatus for controlling friction between leaf springs of a laminated leaf spring assembly | Takeyoshi Shinbori | 1984-06-26 |