Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10703261 | Mounting pedestal, component mounting module, and moving body | Tomoyuki Nakano, Takahiro Miyake, Takashi Matsuda, Masahiro Kasano | 2020-07-07 |
| 8069557 | Method of manufacturing circuit forming board | Toshihiro Nishii, Kunio Kishimoto | 2011-12-06 |
| 8007629 | Method of manufacturing multi-layer circuit board | Toshiaki Takenaka, Tadashi Tojyo, Yuichiro Sugita | 2011-08-30 |
| 7828924 | Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material | Toshiaki Takenaka | 2010-11-09 |
| 7816611 | Circuit board | Toshiaki Takenaka, Tadashi Tojo, Kiyohide Tatsumi | 2010-10-19 |
| 7356916 | Circuit-formed substrate and method of manufacturing circuit-formed substrate | Toshihiro Nishii, Yasuharu Fukui, Kiyohide Tatsumi, Shinji Nakamura, Hideaki Komoda | 2008-04-15 |
| 7281325 | Method of manufacturing circuit board | Toshiaki Takenaka, Tadashi Tojyo | 2007-10-16 |
| 7181839 | Method for producing a circuit board | Toshiaki Takenaka, Tadashi Tojo, Kiyohide Tatsumi | 2007-02-27 |
| 7174632 | Method of manufacturing a double-sided circuit board | Daizo Andoh, Fumio Echigo, Tadashi Nakamura | 2007-02-13 |
| 7103971 | Process for manufacturing a circuit board | Takeshi Suzuki, Satoru Tomekawa, Yasushi Nakagiri, Fumio Echigo | 2006-09-12 |
| 7047629 | Method of manufacturing circuit board | Shinobu Kokufu, Takeshi Suzuki, Fumio Echigo, Daizo Andoh, Tatsuo Ogawa +1 more | 2006-05-23 |
| 6930395 | Circuit substrate having improved connection reliability and a method for manufacturing the same | Satoru Tomekawa, Yoshihisa Yamashita, Takeshi Suzuki, Tadashi Nakamura | 2005-08-16 |
| 6866892 | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board | Takeshi Suzuki, Satoru Tomekawa, Yasushi Nakagiri, Fumio Echigo | 2005-03-15 |
| 6734375 | Circuit board having an interstitial inner via hole structure | Daizo Andoh, Fumio Echigo, Tadashi Nakamura | 2004-05-11 |
| 6713688 | Circuit board and its manufacture method | Shinobu Kokufu, Takeshi Suzuki, Fumio Echigo, Daizo Andoh, Tatsuo Ogawa +1 more | 2004-03-30 |
| 6596381 | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board | Takeshi Suzuki, Satoru Tomekawa, Yasushi Nakagiri, Fumio Echigo | 2003-07-22 |
| 6205657 | Printed circuit board and method for producing the same | Seiichi Nakatani, Masakazu Tanahashi | 2001-03-27 |
| 6174589 | Printed circuit board and method for producing the same | Seiichi Nakatani, Masakazu Tanahashi | 2001-01-16 |
| 6015872 | Substrate for printed circuit board | Masanaru Hasegawa, Kazunori Sakamoto, Hideo Hatanaka | 2000-01-18 |