Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10947377 | Chlorine-containing resin composition | Koichi Tsuda, Yasuhiro Tai | 2021-03-16 |
| 8069557 | Method of manufacturing circuit forming board | Yoshihiro Kawakita, Kunio Kishimoto | 2011-12-06 |
| 7754321 | Method of manufacturing clad board for forming circuitry, clad board and core board for clad board | Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Shinji Nakamura | 2010-07-13 |
| 7685707 | Method for manufacturing circuit forming substrate | — | 2010-03-30 |
| 7624502 | Method for producing circuit-forming board and material for producing circuit-forming board | — | 2009-12-01 |
| 7572500 | Method of manufacturing circuit-forming board and material of circuit-forming board | — | 2009-08-11 |
| 7356916 | Circuit-formed substrate and method of manufacturing circuit-formed substrate | Yasuharu Fukui, Kiyohide Tatsumi, Yoshihiro Kawakita, Shinji Nakamura, Hideaki Komoda | 2008-04-15 |
| 7325300 | Method of manufacturing printed wiring boards | Kiyohide Tatsumi, Shinji Nakamura | 2008-02-05 |
| 7317621 | Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus | Junichi Kimura, Akio Ochi, Shinji Harada | 2008-01-08 |
| 7251885 | Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board | — | 2007-08-07 |
| 7143772 | Method of manufacturing a circuit board and its manufacturing apparatus | Kunio Kishimoto, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura | 2006-12-05 |
| 7105277 | Printing plate, circuit board and method of printing circuit board | Toshiaki Takenaka, Hideaki Komoda, Toshikazu Kondo, Shinji Nakamura | 2006-09-12 |
| 7097394 | Circuit board production method and circuit board production data | Hiroshi Yamaji, Tadao Kimura | 2006-08-29 |
| 7059044 | Method and material for manufacturing circuit-formed substrate | — | 2006-06-13 |
| 7018672 | Circuit board producing method and circuit board producing device | Toshiaki Takenaka, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo | 2006-03-28 |
| 6996902 | Method for manufacturing a circuit board | Takeshi Suzuki, Satoru Tomekawa, Fumio Echigo | 2006-02-14 |
| 6993836 | Circuit board and method of manufacturing same | Toshiaki Takenaka, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto | 2006-02-07 |
| 6893530 | Method and system of drying materials and method of manufacturing circuit boards using the same | Kunio Kishimoto, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura | 2005-05-17 |
| 6890449 | Method for manufacturing printed-circuit board | Eiji Kawamoto, Shigeru Yamane, Toshiaki Takenaka | 2005-05-10 |
| 6838164 | Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material | Shigeru Yamane, Shinji Nakamura, Masayuki Sakai | 2005-01-04 |
| 6833042 | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board | Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Shinji Nakamura | 2004-12-21 |
| 6820331 | Method of manufacturing a circuit board and its manufacturing apparatus | Kunio Kishimoto, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura | 2004-11-23 |
| 6814836 | Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material | Shigeru Yamane, Shinji Nakamura, Masayuki Sakai | 2004-11-09 |
| 6698093 | Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board | — | 2004-03-02 |
| 6700071 | Multi-layer circuit board having at least two or more circuit patterns connected | Toshiaki Takenaka, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto | 2004-03-02 |