Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5813115 | Method of mounting a semiconductor chip on a wiring substrate | Yoshihiko Misawa, Koichi Morita, Setsuo Horimoto | 1998-09-29 |
| 5744382 | Method of packaging electronic chip component and method of bonding of electrode thereof | Yoshifumi Kitayama, Kazuhiro Mori, Takashi Akiguchi | 1998-04-28 |
| 5667129 | IC component mounting method and apparatus | Koichi Morita, Yoshihiko Misawa, Akira Kabeshita, Nobuhisa Watanabe | 1997-09-16 |
| 5646439 | Electronic chip component with passivation film and organic protective film | Yoshifumi Kitayama, Kazuhiro Mori, Takashi Akiguchi | 1997-07-08 |
| 5622590 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani +1 more | 1997-04-22 |
| 5550408 | Semiconductor device | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani +1 more | 1996-08-27 |
| 5436503 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani +1 more | 1995-07-25 |
| 5240170 | Method for bonding lead of IC component with electrode | Kazuto Nishida, Kazuhiro Nobori, Yoshifumi Kitayama | 1993-08-31 |
| 4824010 | Process and apparatus for soldering printed circuit boards | Takao Inoue, Chuichi Matsuda, Schuichi Murakami | 1989-04-25 |
| 4743465 | Method and apparatus for drawing thick film circuit | Shinichi Kudo, Hachiro Nakatsuji | 1988-05-10 |
| 4692351 | Method and apparatus for drawing a thick film circuit | Yukio Maeda, Shinichi Kudo | 1987-09-08 |
| 4425209 | Photosetting resin compositions | Junji Ikeda, Wakahata Tamotsu | 1984-01-10 |