NW

Nobuhisa Watanabe

Sumitomo Electric Industries: 11 patents #2,408 of 21,551Top 15%
SO Sony: 7 patents #6,034 of 25,231Top 25%
Sharp Kabushiki Kaisha: 5 patents #3,007 of 10,731Top 30%
YC Yoshida Industry Co.: 5 patents #6 of 43Top 15%
PA Panasonic: 2 patents #9,678 of 21,108Top 50%
PI Pola Chemical Industries: 1 patents #95 of 199Top 50%
KL Kanebo, Limited: 1 patents #248 of 571Top 45%
Aisin Seiki Kabushiki Kaisha: 1 patents #2,094 of 3,782Top 60%
📍 Nishitokyo, JP: #4 of 277 inventorsTop 2%
Overall (All Time): #114,097 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 1–25 of 32 patents

Patent #TitleCo-InventorsDate
8078310 Component crimping apparatus control method, component crimping apparatus, and measuring tool Tomotaka Nishimoto, Yasuhiro Okada, Chihiro Igarashi, Takanori Yoshitake 2011-12-13
7861908 Component mounting method, component mounting apparatus, and ultrasonic bonding head Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama +5 more 2011-01-04
7668462 Optical wireless communication device 2010-02-23
7417718 Optical distance measuring apparatus Hideo Wada, Takayuki Taminaga 2008-08-26
7349091 Optical object discriminating device Hideo Wada, Takayuki Taminaga, Hajime Kashida 2008-03-25
7317538 Optical two-dimensional velocity and/or movement detector Hideo Wada, Takayuki Taminaga 2008-01-08
7229854 Electronic component mounting method and apparatus and ultrasonic bonding head Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama +5 more 2007-06-12
7049578 Optical movement information detector, movement information detection system, electronic equipment and encoder Hideo Wada, Takayuki Taminaga 2006-05-23
6568580 Bump bonding apparatus and method Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama 2003-05-27
6494358 Bump bonding apparatus and method Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama 2002-12-17
6484252 Microprocessor with improved instruction cycle using time-compressed fetching 2002-11-19
6392202 Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama 2002-05-21
6329640 Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama 2001-12-11
6302317 Bump bonding apparatus and method Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama 2001-10-16
6229874 Monochromator and method of manufacturing the same Noriyoshi Sakabe 2001-05-08
5854745 Method and apparatus for mounting electronic component Nobuhiko Muraoka, Shinji Kanayama, Shinzo Eguchi, Masaru Ichihara, Shuichi Hirata 1998-12-29
5833723 Hydrogen generating apparatus Yasuo Kuwabara, Hiroshige Ota, Akira Matsuoka, Takumi Hayashi 1998-11-10
5713125 Electronic parts mounting method employing memory equipped parts supply devices Masatoshi Yanagawa, Noriaki Yoshida, Takashi Noyama, Masao Iritani, Shinji Morimoto 1998-02-03
5679304 Method of making a push button which is unbonded to a panel cover Mikihiro Kuramitsu 1997-10-21
5667129 IC component mounting method and apparatus Koichi Morita, Yoshihiko Misawa, Keiji Saeki, Akira Kabeshita 1997-09-16
5630085 Microprocessor with improved instruction cycle using time-compressed fetching 1997-05-13
5621907 Microprocessor with memory storing instructions for time-compressed fetching of instruction data for a second cycle within a first machine cycle 1997-04-15
5575059 Tape carrier package mounting apparatus with heaters for bonding tools Nobuhiko Muraoka, Shinjiro Tsuji, Ikuko Obata 1996-11-19
5400497 Electronic parts mounting apparatus having memory equipped parts supply device Masatoshi Yanagawa, Noriaki Yoshida, Takashi Noyama, Masao Iritani, Shinji Morimoto 1995-03-28
5167031 Variable frequency clock pulse generator for microcomputer 1992-11-24