Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7806642 | Receiver for component feed plates and component feeder | Kenichi Ishida, Shuichi Hirata, Satoshi Shida | 2010-10-05 |
| 7797820 | Component mounting apparatus | Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao +4 more | 2010-09-21 |
| 7731469 | Component feeder | Kanji Hata, Shuichi Hirata, Satoshi Shida, Mamoru Nakao | 2010-06-08 |
| 7650691 | Component supply head device and component mounting head device | Satoshi Shida, Yasuharu Ueno, Makoto Morikawa, Hironori Kobayashi, Shuichi Hirata | 2010-01-26 |
| 7552528 | Wafer expanding device, component feeder, and expanding method for wafer sheet | Shuichi Hirata, Takafumi Tsujisawa, Hirokuni Miyazaki, Satoshi Shida | 2009-06-30 |
| 7516878 | Bump formation method and bump forming apparatus for semiconductor wafer | Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2009-04-14 |
| 7452315 | Tool exchange device and tool | Kanji Hata | 2008-11-18 |
| 7387229 | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore | Makoto Imanishi, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae | 2008-06-17 |
| 7353596 | Component mounting method | Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao +4 more | 2008-04-08 |
| 7350289 | Component feeding head apparatus, for holding a component arrayed | Shuichi Hirata, Kanji Hata, Hirokuni Miyazaki, Youhei Matsumoto | 2008-04-01 |
| 7350684 | Apparatus and method for forming bump | Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi +3 more | 2008-04-01 |
| 7306551 | Tool exchange device and tool | Kanji Hata | 2007-12-11 |
| 7052984 | Bump formation method and bump forming apparatus for semiconductor wafer | Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2006-05-30 |
| 7031509 | Method and apparatus for correcting inclination of IC on semiconductor wafer | Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2006-04-18 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate | Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2006-03-21 |
| 7005368 | BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE | Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2006-02-28 |
| 6910613 | Device and method for forming bump | Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi +3 more | 2005-06-28 |
| 6818975 | ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE | Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2004-11-16 |
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Makoto Imanishi, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae | 2004-09-07 |
| 6568580 | Bump bonding apparatus and method | Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2003-05-27 |
| 6494358 | Bump bonding apparatus and method | Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2002-12-17 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama | 2002-05-21 |
| 6329640 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama | 2001-12-11 |
| 6302317 | Bump bonding apparatus and method | Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2001-10-16 |
| 6098868 | Bump forming method and bump bonder | Takaharu Mae, Kiyoshi Mayahara, Masaya Watanabe, Yuichi Takakura, Masahiko Ikeya | 2000-08-08 |