Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10314177 | Component mounting method | Shingo Yamada | 2019-06-04 |
| 7748112 | Component mounting apparatus and component mounting method | Shuichi Hirata, Makoto Morikawa, Shinya Marumo, Yasuharu Ueno | 2010-07-06 |
| 7552528 | Wafer expanding device, component feeder, and expanding method for wafer sheet | Shoriki Narita, Shuichi Hirata, Hirokuni Miyazaki, Satoshi Shida | 2009-06-30 |
| 6572005 | Bump-joining method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada | 2003-06-03 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada +4 more | 2002-08-27 |
| 6321973 | Bump joining method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada | 2001-11-27 |