Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297516 | Semiconductor device | Masayuki Nagamatsu, Junichi Kimura, Tatsuya Kunisato, Ryosuke Usui | 2019-05-21 |
| 7861908 | Component mounting method, component mounting apparatus, and ultrasonic bonding head | Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama +5 more | 2011-01-04 |
| 7748112 | Component mounting apparatus and component mounting method | Shuichi Hirata, Makoto Morikawa, Yasuharu Ueno, Takafumi Tsujisawa | 2010-07-06 |
| 7229854 | Electronic component mounting method and apparatus and ultrasonic bonding head | Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama +5 more | 2007-06-12 |