Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7861908 | Component mounting method, component mounting apparatus, and ultrasonic bonding head | Shozo Minamitani, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita +5 more | 2011-01-04 |
| 7516878 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Shinji Kanayama | 2009-04-14 |
| 7387229 | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore | Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama | 2008-06-17 |
| 7350684 | Apparatus and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Shinji Kanayama, Makoto Imanishi +3 more | 2008-04-01 |
| 7296727 | Apparatus and method for mounting electronic components | Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida +2 more | 2007-11-20 |
| 7229854 | Electronic component mounting method and apparatus and ultrasonic bonding head | Shozo Minamitani, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita +5 more | 2007-06-12 |
| 7052984 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Shinji Kanayama | 2006-05-30 |
| 7031509 | Method and apparatus for correcting inclination of IC on semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Shinji Kanayama | 2006-04-18 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate | Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Shinji Kanayama | 2006-03-21 |
| 7005368 | BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Shinji Kanayama | 2006-02-28 |
| 6910613 | Device and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Shinji Kanayama, Makoto Imanishi +3 more | 2005-06-28 |
| 6818975 | ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Shinji Kanayama | 2004-11-16 |
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama | 2004-09-07 |
| 6619535 | Working method for holding a work object by suction | Makoto Imanishi, Takahiro Yonezawa, Shinji Kanayama, Ryoichiro Katano | 2003-09-16 |
| 6568580 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Shinji Kanayama, Nobuhisa Watanabe | 2003-05-27 |
| 6494358 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Shinji Kanayama, Nobuhisa Watanabe | 2002-12-17 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Makoto Imanishi, Nobuhisa Watanabe, Shinji Kanayama | 2002-05-21 |
| 6329640 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Makoto Imanishi, Nobuhisa Watanabe, Shinji Kanayama | 2001-12-11 |
| 6302317 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Shinji Kanayama, Nobuhisa Watanabe | 2001-10-16 |
| 6098868 | Bump forming method and bump bonder | Kiyoshi Mayahara, Shoriki Narita, Masaya Watanabe, Yuichi Takakura, Masahiko Ikeya | 2000-08-08 |
| 4763811 | Parts feeder | Hiromi Kinoshita, Yoshinobu Maeda, Koji Fujiwara, Hiroshi Nakagawa | 1988-08-16 |