Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10058019 | Bonding apparatus | Akira Yamada, Toshihiko Tsujikawa | 2018-08-21 |
| 9872395 | Component crimping apparatus | Akira Yamada, Shinjiro Tsuji, Satoshi Adachi, Toshihiko Tsujikawa | 2018-01-16 |
| 9739300 | Component crimping apparatus | Akira Yamada, Shinjiro Tsuji, Satoshi Adachi, Toshihiko Tsujikawa | 2017-08-22 |
| 9703129 | Component mounting apparatus | Akira Yamada, Yasuhiro Narikiyo, Toshihiko Tsujikawa | 2017-07-11 |
| 9036022 | Component mounting apparatus, illuminating apparatus used in imaging and illuminating method | Toshihiko Tsujikawa, Ken Ishimatsu | 2015-05-19 |
| 7516878 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2009-04-14 |
| 7052984 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2006-05-30 |
| 7031509 | Method and apparatus for correcting inclination of IC on semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2006-04-18 |
| 7021357 | Component mounting apparatus and component mounting method | Ryoichiro Katano, Shinjiro Tsuji, Shinji Kanayama, Masahiko Ikeya, Akimitsu Mukai +1 more | 2006-04-04 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate | Shoriki Narita, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2006-03-21 |
| 7005368 | BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2006-02-28 |
| 6818975 | ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama | 2004-11-16 |
| 6542238 | Electronic component mounting apparatus | Kazuyuki Nakano, Shozo Fukuda | 2003-04-01 |
| 5872863 | Component detection method | Junichi Hada, Masamichi Morimoto | 1999-02-16 |
| 5825914 | Component detection method | Junichi Hada, Masamichi Morimoto | 1998-10-20 |