Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7423884 | Multilayer circuit board | Yoji Ueda | 2008-09-09 |
| 6455099 | Method and device for applying sealant to IC having bumps | Hiroyuki Yoshida, Yoshifumi Kitayama | 2002-09-24 |
KE
Kouhei Enchi
Overall (All Time): #2,149,927 of 4,157,543Top 55%
2
Patents All Time