Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6647616 | Bump bonding unit with tray storage and transport apparatuses | Hiroyuki Kiyomura, Kenichi Nishino, Kenji Takahashi, Shinji Kanayama | 2003-11-18 |
| 6467158 | Component feeder with load position alignment recognition | Hiroyuki Kiyomura, Shinji Kanayama, Kenji Takahashi, Hiroshi Nasu | 2002-10-22 |
| 6370750 | Component affixing method and apparatus | Shoji Sato, Akihiro Yamamoto, Yoshifumi Kitayama, Yoichi Nakamura | 2002-04-16 |
| 6129203 | IC discarding apparatus for flip chip mounting facility | Hiroyuki Kiyomura, Shinji Kanayama, Kenichi Nishino, Kenji Takahashi, Naomi Kainou | 2000-10-10 |
| 5735203 | Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board | Masahiro Taniguchi, Toshinori Mimura, Kazue Okanoue, Hiroaki Onishi | 1998-04-07 |
| 5693559 | Method for printing solder paste | Masahiro Taniguchi, Toshinori Mimura, Kazue Okanoue, Hiroaki Onishi | 1997-12-02 |
| 5579981 | Reflow apparatus | Kazumi Ishimoto, Yoichi Nakamura, Kurayasu Hamasaki, Kimihito Kuwabara, Masahiro Taniguchi | 1996-12-03 |
| 5314175 | Wire clamping device and wire clamping method | Yasuo Izumi, Akihiro Yamamoto, Yutaka Makino | 1994-05-24 |